A division of K&S

Aluminum Wedge Bonder

K&S is the leader in wire and ribbon bonding for power semiconductors, automotive power modules, and industrial power hybrids. K&S wedge bonders ultrasonically bond round aluminum wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminum ribbons from 500 x 100 to 2000 x 300 microns in cross-section (20 x 4 – 80 x 12 mils).


The Asterion™ wedge bonder is built on an enhanced architecture that includes an expanded bond area, new robust pattern recognition capabilities and extremely tight process controls. Together, these deliver heightened productivity, bonding quality, and reliability.

The enlarged bondable area enhances flexibility and reduces line integration costs. Asterion is driven by a precise new direct-drive motion system that requires minimum maintenance and delivers high repeatability. Powerful new software features, like the graphical editor, make programming complex devices easier, and multisegmented bonding includes flexible tools to deliver an optimized bonding process.Key Advantages:

  • Large bondable area (300 x 300 mm)
  • Multi-lane capability
  • Consistent process results
  • Low cost-of-ownership with reduced preventive maintenance


The PowerFusion™ wedge bonders are driven by a new powerful direct-drive motion system and expanded pattern recognition capabilities which deliver industry leading productivity and reliability. Systems are available in single, dual, or multi-head configurations.

Three models of the PowerFusion bonder are available:

  • PowerFusion TL is the perfect choice for bonding TO power devices

    The TL Model is the perfect choice for bonding single-row to four-row matrix TO power devices.  PowerFusionPS’s industry leading productivity reduces your manufacturing costs and delivers optimum pattern recognition and superior bonding performance.  It is upgradeable to the HL Model should advanced packaging requirements be in your future.
  • PowerFusion HL provides the accuracy and capability required to process the most advanced power packages

    The HL Model is specially designed to enable large wire, small wire and PowerRibbon bonding in advanced packaging designs.  Whether you are bonding high density power devices like SO-8 & PDFN or stretching the wire limit on a matrix D-Pak, the superior indexing accuracy and clamping capabilities of the HL Model deliver consistent quality.
  • PowerFusion HLx can handle extra-wide matrix and IPM leadframes up to 105 mm wide

for more info, https://www.kns.com/